Customization: | Available |
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LED Packaging Type: | Chip |
Chip Material: | InGaN |
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Power Consumption
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3W
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Peak Wavelength
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290-300NM
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Radiant Flux
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50-70MW
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Spectrum Half Width
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11NW
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Forward Current
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350-600MA
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3838Package(308NW 5-6.5V) Reflow temperature 170-230 ºC
UVB includes radiation in the wavelengths from about 280 nm to 315 nm. UVB radiation is commonly used in phototherapy treatments for skin conditions and tanning beds, in plant growth, for cancer treatments, and for photochemical reactions.
Soldering Conditions
• When soldering High Power Led, Heat may affect the electrical and optical characteristics of the LEDs.
• In soldering, do not stress the lead frame and the resin part under high temperatures.
• The silicone part should be protected from mechanical stress or vibration until the High Power Led return to room temperature after soldering.
• Preliminary heating to be at 140˜160ºC max, for 120 seconds max.
• Soldering heat to be at 260ºC max, for 3 seconds max.
• For manual soldering is not more than 3 seconds at max 260ºC, under soldering iron.
Notes:
1. The Anode side of the emitter is denoted by the "+" Sign in the lead frame.
2. Electrical insulation between the case and the board is required. Do not electrically connect either the anode or cathode to the slug.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. Unless otherwise indicated, tolerances are ± 0.2mm.
6. Please do not bend the leads of the LED, otherwise it will damage the LED.
7. Please do not use a force impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure.